With the maturity of wave soldering technology and the improvement of the grades of domestic EMS manufacturers, wave soldering equipment is still very promising. At present, due to imperfections in technology and process, the defects of selective wave soldering are still quite a few. In this paper, the selective wave soldering machine is taken as an example to introduce and analyze the selective welding from two aspects of equipment and process. The main aspects of the machine are described in terms of equipment. The process of selective soldering is introduced in the lead-free reflow process. Finally, several defects that are most likely to occur during selective wave soldering are analyzed.

Lead-in reflow soldering input feedback channel (signal acquisition) This process is to place the chip components accurately on the surface of the PCB surface on which the solder paste or paste is printed. There are two kinds of mounting methods. The comparison of lead-free reflow soldering is as follows: application method advantages and disadvantages, machine mounting batch size is large, the supply cycle is tight for large-scale production, the use process is complicated, and the investment is large manual placement in small and medium batch production. Easy product development and operation, low lead-free reflow cost, high productivity, manual manual placement of main tools: vacuum pen, tweezers, IC suction aligner, low power stereo microscope or magnifying glass, etc. . Lead-free reflow switch output channel (control SSR), serial output control inverter (control conveyor speed) Shenzhen Weida Electronic Equipment Co., Ltd.