Overview
Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5 lead-free alloys are suitable for the replacement of Sn63 alloy. This Sn97Ag3 and Sn96Ag4 variant is used to stabilize/reduce the copper content, which requires the wavesolder bath to depend on the lead-free wave soldering process conditions. With all the alpha metal rod solder, Alpha's proprietary Vaculy® alloying process is used to remove impurities, especially certain oxides.
Features and benefits
characteristic
Yield – best yield, perform all Sn / Cu based materials
?? Fast wetting rate, continuous test based on 0.65s 1.00s, based on Sn / cu material
?? Lead-free wave solder slag formation - Due to the Vaculoy process and the addition of tin slag reducing agent, the formation rate of dross is the lowest among similar products.

advantage
Excellent solderability because lead-free wave solder solder infiltration speed is fast
 Very good drainage system with lower levels compared to Sn/Cu
?? Provides a wide range of throughput technologies with excellent performance

The proprietary Vaculoy process is a very effective way to eliminate solder including solder. This is extremely important because it includes oxides that produce excessive drossing and increase viscosity solder. Lead-free wave solder high viscosity can improve soldering defects (ie solder bridging)
application
Sn96.5Ag3.0Cu0.5 and Sn95.5Ag4Cu0.5 are suitable for wave soldering and surface mount applications. A solder pot temperature of 255 - 265 ° C (491-509 ° F) is recommended. Suitable for lead-free wave soldering fluxes, please see our selection guide. Lead-free recycling services, including container-specific lead-free, can also be consulted at your local sales office.
Availability
The Vaculoy package includes 1kg (2.2lb) solder bars, solder bumps, ingots and self-feeding cored wire.